Sulfamate Nickel Plating

HIGHLY DUCTILE…LOW STRESS…SOLDERABLE…WELDABLE…HIGHLY CONDUCTIVE

Electrolurgy provides both Matte and Semi-Bright Sulfamate Nickel plating.  The matte deposit is 99.9% pure and more ductile, while the semi-bright deposit contains organic brighteners. Sulfamate nickel plating excels where a highly ductile, low-stress nickel deposit is preferred such as flexing or crimping applications as well as joining functions such as soldering, brazing, epoxy bonding or welding.

Electrolurgy currently services a wide range of industries in sulfamate nickel plating including the interconnect, telecommunications, power transmission, medical and defense markets. Electrolurgy can precede the sulfamate nickel deposit with an underplate of copper plating if required and can provide sulfamate nickel plating as an underplate to final nickel deposits such as bright nickel plating or electroless nickel plating for duplex applications. Sulfamate nickel plating also serves as an excellent underplate for tin plating, silver plating and gold plating.

NICKEL DEPOSIT CHARACTERISTICS

Matte Sulfamate nickel plating produces a 99.9% pure deposit free of organic brighteners or levelers.  The high purity of the deposit affords temperature resistance up to the 1400 degree C melting point of pure nickel.   The matte deposit has an appearance with a slight yellow or golden cast (not popular for decorative appeal).  The deposits have extremely low deposit stress that can be in the compressive range.  The low stress of sulfamate nickel plating yields nickel deposits with high ductility, elongation and machinability far superior to other nickel deposits.  If a brighter ductile deposit is required, the semi-bright bath is recommended.

APPLICATION INFORMATION

Sulfamate nickel plating excels in joining applications including brazing, soldering, over molding, epoxy bonding and welding.  The high purity and lack of codeposited organics improves the wetting of the nickel deposit when soldering and makes sulfamate nickel plating the preferred underplate and diffusion barrier when using silver plating or gold plating for solderability or brazing purposes.  In addition, the unleveled matte surface makes sulfamate nickel plating the choice for adhesion in over-molding or epoxy bonding applications.

Semi-Bright Sulfamate should be used in applications where a brighter finish is required for a more decorative appearance, or where handling would discolor the matte finish.  The semi-bright deposit has excellent corrosion resistance and is harder than the matte bath, but slightly reduced solderability and ductility.

ELECTROLURGY’S SULFAMATE NICKEL PLATING CAPABILITIES:

  • Part Lengths Up to 36″ and 40Pounds
  • Plating thicknesses from 0.0001 to 0.0020 inches
  • Rack and Barrel Plating Available
  • Precision masking for selective surface plating
  • Salt spray corrosion testing per ASTM B 117
  • Post-plate hydrogen embrittlement relief
  • XRF thickness analysis

APPLICABLE SPECIFICATIONS:

DESIGN CONSIDERATIONS

  • 99.9% Pure Nickel Deposits are stable up to nearly 1400 Degrees C (Nickel’s Melting Point)
  • Recessed areas and blind holes get less or no plating depending on solution flow and current density
  • Highly ductile coating allows it to be easily brazed or welded
  • Excellent undercoat for Silver or Gold plate to increase corrosion resistance of substrates

COMMON APPLICATIONS OF SULFAMATE NICKEL COATINGS:

  • Electrical Equipment: Due to solderability and conductivity properties.
  • Molds & Dies: Corrosion protection minimizes erosion and abrasion. Low coefficient of friction improves release.
  • Food Service Equipment: For superior corrosion and wear resistance, attractive finish and cleanliness.
  • Electronics applications for corrosion protection where high solderability is required
  • Aerospace Industry: Parts requiring a high degree of ductility